 適用于:酸性電鍍銅、線路板、電鑄模、制版電鍍等。Apply to:apply to: Acid electroplated copper, electric circuit board, electroforming mould and electroplating for printing plate making etc..
| 性能描述 |
主元素Major element 雜質元素含量（%）Impurity element content
元素Element Cu P Pb Zn Ni Mn Fe AI Si Sb Sn As Cd Ag
含量Content ≥99.92 ≥0.040≤0.065 ≤0.003 ≤0.003 ≤0.002 ≤0.001 ≤0.003 ≤0.001 ≤0.001 ≤0.001 ≤0.003 ≤0.002 ≤0.0001 ≤0.002 | , |
