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Process for the functional oxidation of inner-layers for printed circuit boards.
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Reliable and low cost black oxide process for Multi-Layer manufacturing |
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By varying the concentrations of part A and part B together with the process parameters either black or brown oxide can be formed. |
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Controlled crystal growth |
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Optional Post-Dip for highest acid resistance The formation of pink ring is largely minimized by this Oxidation Post-Dip. |
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Suitable for vertical and horizontal techniques |
